| Processor Number |
i7-870 |
| Launch Date |
Q3’09 |
| Cache |
8 MB |
| DMI |
2.5 GT/s |
| Instruction Set |
64-bit |
| Instruction Set Extensions |
SSE4.2 |
| Embedded Options Available |
no |
| Lithography |
45 nm |
| # of Cores |
4 |
| # of Threads |
8 |
| Processor Base Frequency |
2.93 GHz |
| Max Turbo Frequency |
3.6 GHz |
| TDP |
95 W |
| Memory Specification |
| Max Memory Size |
16 GB |
| Channels |
Dual Channel |
| Memory Types |
DDR3 1066/1333 |
| Max Memory Bandwidth |
21 GB/s |
| Physical Address Extensions |
36-bit |
| ECC Memory Supported ‡ |
No |
| Other |
| PCI Express Revision |
2 |
| PCI Express Configurations ‡ |
1×16, 2×8 |
| Max # of PCI Express Lanes |
16 |
| Socket Type |
LGA 1156 |
| Virtualization Technology |
Yes |
| AES New Instructions |
no |
| Turbo Boost Technology |
1 |
| Hyper-Threading Technology |
yes |
| Idle States |
yes |
| Trusted Execution Technology ‡ |
yes |
| Execute Disable Bit ‡ |
yes |
| Working temperature |
72.7℃ |
| Size |
45x33x31cm |
| Weight |
12.5kg |
| Warranty |
1 year |
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